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How can voiding in SAC305 solder joints used for LGA components applied on an ENIG surface finish be minimzed?

Haastert, R.Y. van (2017) How can voiding in SAC305 solder joints used for LGA components applied on an ENIG surface finish be minimzed? Bachelor's Thesis, Applied Physics.

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Abstract

De begeleider en/of auteur heeft geen toestemming gegeven tot het openbaar maken van de scriptie. The supervisor and/or the author did not authorize public publication of the thesis.

Item Type: Thesis (Bachelor's Thesis)
Degree programme: Applied Physics
Thesis type: Bachelor's Thesis
Language: English
Date Deposited: 15 Feb 2018 12:53
Last Modified: 15 Feb 2018 12:53
URI: http://fse.studenttheses.ub.rug.nl/id/eprint/16469

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