Haastert, R.Y. van (2017) How can voiding in SAC305 solder joints used for LGA components applied on an ENIG surface finish be minimzed? Bachelor's Thesis, Applied Physics.
Full text not available from this repository.Abstract
De begeleider en/of auteur heeft geen toestemming gegeven tot het openbaar maken van de scriptie. The supervisor and/or the author did not authorize public publication of the thesis.
| Item Type: | Thesis (Bachelor's Thesis) |
|---|---|
| Degree programme: | Applied Physics |
| Thesis type: | Bachelor's Thesis |
| Language: | English |
| Date Deposited: | 15 Feb 2018 12:53 |
| Last Modified: | 15 Feb 2018 12:53 |
| URI: | https://fse.studenttheses.ub.rug.nl/id/eprint/16469 |
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