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3D multi-PCB RFI shielding design with dynamic RF interconnect integration

Vliet, Jasper, van (2021) 3D multi-PCB RFI shielding design with dynamic RF interconnect integration. Design Project, Mechanical Engineering.

MDP_Final_report - Jasper van Vliet s3531422.pdf

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RFI shielding is one of the most important things for the reliable operation of analogue and digital electronics during their lifetime. In this master design project (MDP) the attenuation performance of metal at plastic and carbon fibre injected plastic enclosure designs is examined. The design question of this MDP is ‘How do I design an enclosure for multiple PCBs which shields them from RFI of all possible sources?’. During the project prototypes with different shielding materials are realised and measured. The results show that metal at plastic is a viable option for the use of RFI shielding and that specific carbon fibre injected plastics have potential also to be used for this application.

Item Type: Thesis (Design Project)
Supervisor name: Kottapalli, A.G.P. and Munoz Arias, M.
Degree programme: Mechanical Engineering
Thesis type: Design Project
Language: English
Date Deposited: 26 Jan 2021 11:26
Last Modified: 26 Jan 2021 11:26

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